Thin silicon via crack-assi... - Researchers

Thin silicon via crack-assisted layer exfoliation for photoelectrochemical water splitting

Citation

Lee, Y, Gupta, B, Tan, H et al. 2021, 'Thin silicon via crack-assisted layer exfoliation for photoelectrochemical water splitting', iScience, vol. 24, no. 8.

Year

2021

ANU Authors

Professor H. Hoe Tan
Professor Chennupati Jagadish
Associate Professor Siva Karuturi

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